Future Concepts division- publications
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Accelerated aggregation kinetics and hydrodynamic floc separation for municipal water treatment
This paper reports on improvements to aggregation kinetics of colloidal particles in municipal water treatment by injection of mature floc as seed for rapid floc formation.
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Pervasive model adaptation: integration of planning and information gathering in dynamic production systems
This paper proposes the novel idea of pervasive model adaptation in a production system, where the model is dynamically updated using production output.
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Front side metallization of crystalline silicon solar cells using selectively laser drilled contact openings
Selective removal of the silicon nitride dielectric layer has been demonstrated even using nanosecond range laser pulses, through carefully controlling the energy density of laser pulses.
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Control in printing systems: modular reconfigurable media paths
Abstract The remarkable drop in the cost of embedded computing, sensing, and actuation is creating a corresponding explosion in the use of these technologies in new systems. In order to…
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The informativity of negative assertions and the rise of NPIs
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Electrical stability of inkjet-patterned organic complementary inverters measured in ambient conditions
Complementary organic inverters comprising p- and n-type semiconductors and inorganic-organic bilayer dielectrics were fabricated by inkjet patterning of both the metal contacts and the semiconductors.
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Many-to-many communication for mobile ad hoc networks
We introduce a collaboration-driven approach to the sharing of the available bandwidth in wireless ad hoc networks, which we call many-to-many communication, that allows concurrent multi-packet transmissions (MPTs) and multi-packet…
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Wafer level packaging with soldered stress engineered micro-springs
Micro springs for integrated circuit test and packaging are demonstrated as soldered flip chip interconnects in a direct die to printed circuit board package.
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Flexible printed sensor tape for novel applications
We are developing a blast sensor tape to detect the occurrence of events that cause traumatic brain injury (TBI) in military environments.
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Novel packaging with rematable spring interconnect chips for MCM
A novel packaging approach has been demonstrated for circuits connected with flexible microsprings.
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Degrees of separation
This talk will describe how we induce precipitation or suspension formation from dissolved materials, promote aggregation of smaller suspensions into larger and more robust agglomerates, and capture for reuse of…
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Is it too late for PAKE?
In this paper, we report the results of a systematic investigation of various practical issues and challenges in deploying PAKE for web authentication.